High-Reliability Interconnect Test improve design insight.

Customer Benefits

Early-onset Failure Detection

Enhanced Reliability

Package-level Design Insight

Key Technology


Product Description

Our HRIT (High-Reliability Interconnect Test) Platform is an intuitive application that allows users to define thermal profiles and control the execution of oven cycling. Users can also define UUT features of interest for performance tracking.

The HRIT Platform allows monitorization of PCB path impedance at desired points through the thermal cycle, logging and graphing data versus cycle for the test duration. A database of PCB features and performance is maintained for correlation and analysis while providing reports charting the best performance features of PCB design selection because impedance data can be used to detect early-onset failure (crack growth).

Platform capabilities include user-defined data presentations which draw from four dimensions of test design to identify effects of interest, a wide range of analysis parameters, and enhanced sensitivity and statistical modeling. Users can compare with other Package/Pitch/Routes to assess manufacturability. In addition, open failures can be fed to a two-parameter Weibull analysis for predictive modeling.


This platform has been deployed in assessing new PCB design reliability, with an emphasis on high PCB layer count. This application had an evolving design with varied characteristics and multiple BGA sites. Needs for this process included characterizing reliability of various PCB design aspects, tracking and correlating degradation of performance, and quantifying with data the most robust/highest performing designs to provide rationale for design selection.

Industries Served